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DIN EN 60068-2-58 VDE 0468-2-58:2018-09
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DIN EN 60068-2-58 VDE 0468-2-58:2018-09
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:2018More info
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| Author | VDE |
|---|---|
| Editor | VDE |
| Document type | Standard |
| Format | Paper |
| ICS | 19.040 : Environmental testing
|
| Number of pages | 44 |
| Replace | DIN EN 60068-2-58 (2016-01) |
| Cross references | EN 60068-2-58 (2015-05), IDT |
| Weight(kg.) | 0.1748 |
| Year | 2018 |
| Document history | DIN EN 60068-2-58 (2018-09) |
| Country | Germany |
| Keyword | DIN EN 60068;DIN EN 60068-2;EN 60068;EN 60068-2;EN 60068-2-58;60068 |