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BS IEC 62047-31:2019
New product
BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materialsMore info
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Standard |
| Format | File |
| EAN ISBN | 978 0 580 96660 6 |
| ICS | 31.080.99 : Other semiconductor devices
|
| Number of pages | 16 |
| Cross references | IEC 62047-31 Ed1.0 |
| Year | 2019 |
| Country | United Kingdom |